Actions for International Symposium on Electronic Materials and Packaging (EMAP2000) [electronic resource] : November 30-December 2, 2000, Hong Kong

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International Symposium on Electronic Materials and Packaging (EMAP2000) [electronic resource] : November 30-December 2, 2000, Hong Kong / organized by Hong Kong University of Science and Technology, Department of Mechanical Engineering & EPACK LAB ; in collaboration with Institute of Electrical and Electronics Engineres, IEEE Component, Packaging & Manufacturing Technology, Hong Kong Chapter

Conference Author
EMAP2000 (2000 : Hong Kong, China)
Additional Titles
EMAP2000 and Electronic materials and packaging
Published
Piscataway, New Jersey : IEEE, c2000.
Physical Description
xii, 478 p. : ill. ; 30 cm.
Additional Creators
Hong Kong University of Science and Technology. Department of Mechanical Engineering, EPACK LAB, Institute of Electrical and Electronics Engineers, and Components, Packaging & Manufacturing Technology Society. Hong Kong Chapter
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ISBN
0780366549
Bibliography Note
Includes bibliographic references.
View MARC record | catkey: 20034553