International Symposium on Electronic Materials and Packaging (EMAP2000) [electronic resource] : November 30-December 2, 2000, Hong Kong / organized by Hong Kong University of Science and Technology, Department of Mechanical Engineering & EPACK LAB ; in collaboration with Institute of Electrical and Electronics Engineres, IEEE Component, Packaging & Manufacturing Technology, Hong Kong Chapter
- Conference Author:
- EMAP2000 (2000 : Hong Kong, China)
- Additional Titles:
- EMAP2000
Electronic materials and packaging - Published:
- Piscataway, New Jersey : IEEE, c2000.
- Physical Description:
- xii, 478 p. : ill. ; 30 cm.
- Additional Creators:
- Hong Kong University of Science and Technology. Department of Mechanical Engineering
EPACK LAB
Institute of Electrical and Electronics Engineers
Components, Packaging & Manufacturing Technology Society. Hong Kong Chapter - Access Online:
- serialssolutions.com
- Restrictions on Access:
- License restrictions may limit access.
- Subject(s):
- Genre(s):
- ISBN:
- 0780366549
- Bibliography Note:
- Includes bibliographic references.
View MARC record | catkey: 20034553