Low and high dielectric constant materials : materials science, processing, and reliability issues : proceedings of the fourth international symposium : and, thin film materials for advanced packaging technologies : proceedings of the second international symposium / editors: R. Singh [and others].
- Additional Titles
- Thin film materials for advanced packaging technologies
- Published
- Pennington , NJ : Electrochemical Society, Inc., [2000]
- Copyright Date
- ©2000
- Physical Description
- viii, 226 pages : illustrations ; 24 cm.
- Additional Creators
- Singh, Rajendra, 1946-, Electrochemical Society. Dielectric Science and Technology Division, Electrochemical Society. Electronics Division, International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues (4th : 1999 : Seattle, Wash.), and International Symposium on Thin Film Materials for Advanced Packaging (2nd : 1999 : Seattle, Wash.)
- Series
- Subject(s)
- ISBN
- 156677229X
- Note
- "Dielectric Science and Technology and Electronics Divisions."
"Proceedings of the Fourth International Symposium on Low and High Dielectric Constant Materials and the Proceedings of the Second International Symposium on Thin Film Materials for Advanced Packaging ... held in Seattle ... May 2-7, 1999"--p. iii. - Bibliography Note
- Includes bibliographical references and index.
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