Annotation This workshop will focus on low temperature bonding technologies which will ultimately lead to entirely new manufacturing approaches to 3D and heterogeneous integration of semiconductor devices and microsystems, as well as photonic systemsThe workshop invites papers that document new developments in low temperature bonding technologies, new device applications, facilities and technologies for mass production, and basic science relating to these technologiesTheir impact on the paradigm shift in the semiconductor industry along with 3D integration technologies is also of interest
