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High-Temperature Air-Cooled Power Electronics Thermal Design [electronic resource] : Annual Progress Report

Published
Washington, D.C. : United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy, 2016.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy
Physical Description
11 pages : digital, PDF file
Additional Creators
National Renewable Energy Laboratory (U.S.), United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
Power electronics that use high-temperature devices pose a challenge for thermal management. With the devices running at higher temperatures and having a smaller footprint, the heat fluxes increase from previous power electronic designs. This project overview presents an approach to examine and design thermal management strategies through cooling technologies to keep devices within temperature limits, dissipate the heat generated by the devices and protect electrical interconnects and other components for inverter, converter, and charger applications. This analysis, validation, and demonstration intends to take a multi-scale approach over the device, module, and system levels to reduce size, weight, and cost.
Report Numbers
E 1.99:nrel/mp--5400-62784
nrel/mp--5400-62784
Subject(s)
Other Subject(s)
Note
Published through SciTech Connect.
08/01/2016.
"nrel/mp--5400-62784"
Scot Waye.
Funding Information
AC36-08GO28308
View MARC record | catkey: 23491928