High-Temperature Air-Cooled Power Electronics Thermal Design [electronic resource] : Annual Progress Report
- Published:
- Washington, D.C. : United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy, 2016. and Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy
- Physical Description:
- 11 pages : digital, PDF file
- Additional Creators:
- National Renewable Energy Laboratory (U.S.), United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy, and United States. Department of Energy. Office of Scientific and Technical Information
- Access Online:
- www.osti.gov
- Restrictions on Access:
- Free-to-read Unrestricted online access
- Summary:
- Power electronics that use high-temperature devices pose a challenge for thermal management. With the devices running at higher temperatures and having a smaller footprint, the heat fluxes increase from previous power electronic designs. This project overview presents an approach to examine and design thermal management strategies through cooling technologies to keep devices within temperature limits, dissipate the heat generated by the devices and protect electrical interconnects and other components for inverter, converter, and charger applications. This analysis, validation, and demonstration intends to take a multi-scale approach over the device, module, and system levels to reduce size, weight, and cost.
- Subject(s):
- Note:
- Published through SciTech Connect., 08/01/2016., "nrel/mp--5400-62784", and Scot Waye.
- Funding Information:
- AC36-08GO28308
View MARC record | catkey: 23491928