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Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies (Presentation) [electronic resource].

Published
Washington, D.C. : United States. Dept. of Energy, 2010.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy
Physical Description
26 pages : digital, PDF file
Additional Creators
National Renewable Energy Laboratory (U.S.), United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
Heat removal for power semiconductor devices is critical for robust operation. Because there are different packaging options, different thermal management technologies, and a range of applications, there is a need for a methodology to match cooling technologies and package configurations to target applications. To meet this need, a methodology was developed to compare the sensitivity of cooling technologies on the overall package thermal performance over a range of power semiconductor packaging configurations. The results provide insight into the trade-offs associated with cooling technologies and package configurations. The approach provides a method for comparing new developments in power semiconductor packages and identifying potential thermal control technologies for the package. The results can help users select the appropriate combination of packaging configuration and cooling technology for the desired application.
Report Numbers
E 1.99:nrel/pr-540-48147
nrel/pr-540-48147
Subject(s)
Other Subject(s)
Note
Published through SciTech Connect.
04/27/2010.
"nrel/pr-540-48147"
Presented at the IMAPS 2nd Advanced Technology Workshop on Automotive Microelectronics and Packaging, 27-28 April 2010, Dearborn, Michigan.
Bennion, K.; Moreno, G.
Funding Information
AC36-08GO28308
View MARC record | catkey: 23492592