Power Electronics Thermal Management R&D (Presentation) [electronic resource].
- Washington, D.C. : Vehicle Technologies Program (U.S.), 2014.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy
- Physical Description:
- 24 pages : digital, PDF file
- Additional Creators:
- National Renewable Energy Laboratory (U.S.), Vehicle Technologies Program (U.S.), and United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- This project will investigate and develop thermal-management strategies for wide bandgap (WBG)-based power electronics systems. Research will be carried out to deal with thermal aspects at the module- and system-level. Module-level research will focus on die- and substrate-integrated cooling strategies and heat-transfer enhancement technologies. System-level research will focus on thermal-management strategies for the entire power electronics system to enable smart packaging solutions. One challenge with WBG device-based power electronics is that although losses in the form of heat may be lower, the footprint of the components is also likely to be reduced to reduce cost, weight, and volume. Combined with higher operational temperatures, this creates higher heat fluxes which much be removed from a smaller footprint, requiring advanced cooling strategies.
- Report Numbers:
- E 1.99:nrel/pr-5400-63002
- Other Subject(s):
- Published through SciTech Connect.
Presented at the FY15 APEEM Kickoff Meeting, 18-20 November 2014, Oak Ridge National Laboratory, Oak Ridge, Tennessee.
- Funding Information:
View MARC record | catkey: 23760338