Cooling system for electronic components [electronic resource].

Published: Washington, D.C. : United States. Dept. of Energy, 2016.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy
Additional Creators: United States. Department of Energy and United States. Department of Energy. Office of Scientific and Technical Information

Access Online

www.osti.gov

Availability

Finding items...

Restrictions on Access

Free-to-read Unrestricted online access

Summary

Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Report Numbers

E 1.99:9,342,121
9,342,121

Subject(s)

Note

Published through SciTech Connect.
05/17/2016.
"9,342,121"
"12/417,921"
William James Anderl; Evan George Colgan; James Dorance Gerken; Christopher Michael Marroquin; Shurong Tian.
International Business Machines Corporation, Armonk, NY (United States)

Funding Information

B554331

View MARC record | catkey: 23761049