Performance and Reliability of Bonded Interfaces for High-Temperature Packaging [electronic resource].
Published
Washington, D.C. : United States. Office of the Assistant Secretary of Energy Efficiency and Renewable Energy, 2016. Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy
This is a technical review of the DOE VTO EDT project EDT063, Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. A procedure for analyzing the reliability of sintered-silver through experimental thermal cycling and crack propagation modeling has been outlined and results have been presented.
Published through SciTech Connect. 06/08/2016. "nrel/pr-5400-66048" Presented at the Vehicle Technologies Office (VTO) Annual Merit Review and Peer Evaluation, 6-10 June 2016, Washington, D.C. DeVoto, Douglas.