Additive manufacturing of hybrid circuits [electronic resource].

Published: Washington, D.C. : United States. National Nuclear Security Administration, 2016.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy
Physical Description: 22 pages : digital, PDF file
Additional Creators: Sandia National Laboratories, United States. National Nuclear Security Administration, and United States. Department of Energy. Office of Scientific and Technical Information

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Summary

There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. As a result, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

Report Numbers

E 1.99:sand--2016-0248j
sand--2016-0248j

Subject(s)

Materials Science

Note

Published through SciTech Connect.
03/26/2016.
"sand--2016-0248j"
"618373"
Annual Review of Materials Research 46 1 ISSN 1531-7331 AM
Nelson S. Bell; Pylin Sarobol; Adam Cook; Paul G. Clem; David M. Keicher; Deidre Hirschfeld; Aaron Christopher Hall.

Funding Information

AC04-94AL85000

View MARC record | catkey: 24056064