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Methods and devices for fabricating and assembling printable semiconductor elements [electronic resource].

Published
Washington, D.C. : United States. Dept. of Energy, 2011.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy
Additional Creators
University of Illinois at Urbana-Champaign, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Report Numbers
E 1.99:7,982,296
7,982,296
Subject(s)
Note
Published through SciTech Connect.
07/19/2011.
"7,982,296"
"US Patent Application 12/564,566"
Nuzzo, Ralph G. (Champaign, IL); Rogers, John A. (Champaign, IL); Menard, Etienne (Durham, NC); Lee, Keon Jae (Daejeon, KR); Khang, Dahl-Young (Urbana, IL); Sun, Yugang (Champaign, IL); Meitl, Matthew (Raleigh, NC); Zhu, Zhengtao (Urbana, IL).
Funding Information
FG02-91ER45439
View MARC record | catkey: 24094162