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Composition and method for removing photoresist materials from electronic components [electronic resource].

Published
Washington, D.C. : United States. Dept. of Energy, 2005.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy
Additional Creators
United States. Department of Energy and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
Composition and method for removing photoresist materials from electronic components. The composition is a mixture of at least one dense phase fluid and at least one dense phase fluid modifier. The method includes exposing a substrate to at least one pulse of the composition in a supercritical state to remove photoresist materials from the substrate.
Report Numbers
E 1.99:6,846,789
6,846,789
Subject(s)
Note
Published through SciTech Connect.
01/25/2005.
"6,846,789"
"10/133,709"
Davenhall, Leisa; Rubin, James; Taylor, Craig.
University Of California, The Regents Of
Funding Information
W-7405-ENG-36
View MARC record | catkey: 24504905