Laser ablative fluxless soldering (LAFS) [electronic resource] : 60Sn-40Pb solder wettability tests on laser cleaned OFHC copper substrates
- Published
- Washington, D.C. : United States. Dept. of Energy, 1991.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy - Physical Description
- 20 pages : digital, PDF file
- Additional Creators
- Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
Access Online
- Restrictions on Access
- Free-to-read Unrestricted online access
- Summary
- OFHC copper substrates, cleaned by laser ablation under argon and helium gas, were tested for solder wettability by 60Sn-40Pb using an area-of-spread method. The wettability of copper surfaces cleaned under both argon and helium gas was found to equal or exceed the wettability obtained on this surface in air using a standard RMA flux. The area of spread on copper substrates cleaned under helium was eight times larger than the area of spread of substrates cleaned under argon. The enhanced spreading observed on the substrates cleaned under helium gas was found to be due to surface roughness. 11 refs., 8 figs., 2 tabs.
- Report Numbers
- E 1.99:sand--91-1670c
E 1.99: conf-9109259--10
conf-9109259--10
sand--91-1670c - Subject(s)
- Note
- Published through SciTech Connect.
01/01/1991.
"sand--91-1670c"
" conf-9109259--10"
"TI92020150"
1. international congress on environmentally conscious manufacturing,Santa Fe, NM (United States),18 Sep 1991.
Peebles, H. C.; Keicher, D. M.; Hosking, F. M.; Hlava, P. F.; Creager, N. A. - Funding Information
- AC04-76DP00789
View MARC record | catkey: 24505726