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Electroplating and electroless plating of copper & its alloys / edited by N. Kanani

Additional Titles
Title of CD-ROM: Database-surface treatment of copper & its alloys
Published
Materials Park, Ohio : ASM International ; Stevenage, Herts : Finishing Publications, [2003]
Copyright Date
©2003
Physical Description
ix, 304 pages : illustrations ; 24 cm + 1 CD-ROM (4 3/4 in.).
Additional Creators
Kanani, Nasser

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Contents
ELECTRODEPOSITION OF COPPER AND ITS ALLOYS: Processes -- The deposition of copper alloys -- Alkaline copper plating baths -- THE TECHNOLOGY OF ELECTRODEPOSITION OF COPPER AND COPPER ALLOYS: Cyanide plating baths -- Acid sulphate copper plating baths -- Other copper plating baths -- Barrel copper plating -- Rack plating -- Continuous copper plating -- Copper-zinc alloy (brass) plating -- Copper-tin alloy (bronze) plating -- Copper plating solutions for surface pre-treatment -- Electroforming -- THE PROPERTIES OF COPPER AND COPPER ALLOY COATINGS: Copper coatings -- Copper alloy coating -- THE APPLICATIONS OF ELECTRODEPOSITED COPPER AND COPPER ALLOY COATINGS: Decorative applications -- Functional applications -- Colouring of copper and copper alloy coatings -- Black colouring (black oxide) in the printed circuit board industry -- Electrical and electronics industries -- ELECTROLESSLY DEPOSITED COPPER COATINGS: Historical review -- Processes -- Electroless copper plating by chemical reduction -- Pre-treatment -- Applications -- Copper plating baths for printed circuit board manufacture -- PROPERTIES OF ELECTROLESS COPPER COATINGS: Copper coatings -- Surface morphology -- Surface roughness -- Degree of purity -- Microstructures -- Ductility -- Tensile strength -- Hardness -- Electrical resistance -- QUALITY ASSURANCE, ANALYSIS AND PROCESS OPTIMIZATION IN COPPER DEPOSITION: Monitoring and analysis of solutions -- Process optimization -- and STRIPPING OF COPPER AND COPPER ALLOY COATINGS: Copper stripping processes -- Surface preparation before further electroplating -- Waste disposal methods for copper stripping solutions -- RECYCLING AND EFFLUENT TREATMENT: The problem -- Processes in recycling technology -- Effluent treatment -- COPPER IN MICROTECHNOLOGY: Electrodeposition of metallic microstructures -- Electrolytes and plant technology -- Plant technology -- The influence of the basis material -- Applications -- COPPER IN PRINTED CIRCUIT BOARD TECHNOLOGY: Printed circuit board construction -- Possible methods of constructing of printed circuit boards subtractive, semi-additive, and fully-additive processes -- Electrodeposition of planar high-ductility copper coatings -- Chemical copper plating -- Printed circuit boards with micro-holes - high density interconnection (HDI).
Subject(s)
ISBN
0904477266
Note
Includes index.
"Authorised translation from the German edition, published by Verlag Eugen G Leuze, Bad Saulgau, D88348."
View MARC record | catkey: 2609621