Dip-Soldered Printed Circuit Joint Characteristics / Alfred A. Johns, Eugen S. Miller
- Conference Author
- Symposium on Solder (1956 : Atlantic City, N. J.)
- Physical Description
- 1 online resource (14 pages) : illustrations, figures, tables
- Additional Creators
- Johns, Alfred A., Miller, Eugen S., American Society for Testing and Materials, and ASTM International
Access Online
- Restrictions on Access
- Subscription required for access to full text.
License restrictions may limit access. - Summary
- Considerable emphasis has been placed upon a program of investigation of dipsoldered joints from the standpoint of results which can be anticipated in production. This program covers four fields of information on dip-soldered joints:.
- Dates of Publication and/or Sequential Designation
- Volume 1957, Issue 189 (January 1957)
- Subject(s)
- ISBN
- 9780803159389 (e-ISBN)
9780803160927
0803160925 - Digital File Characteristics
- text file PDF
- Bibliography Note
- Includes bibliographical references.
- Other Forms
- Also available online via the World Wide Web. Tables of contents and abstracts freely available; full-text articles available by subscription.
Full text article also available for purchase.
Also available in PDF edition. - Reproduction Note
- Electronic reproduction. W. Conshohocken, Pa. : ASTM International, 1957. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.
- Technical Details
- Mode of access: World Wide Web.
- Source of Acquisition
- ASTM International PDF Purchase price USD25.
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