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The Ball Bond Shear Test : Its Methodology and Application / HK. Charles, GV. Clatterbaugh, JA. Weiner

Conference Author
Semiconductor Processing (1984 : San Jose, California)
Physical Description
1 online resource (29 pages) : illustrations, figures, tables
Additional Creators
Charles, HK., Clatterbaugh, GV., Weiner, JA., American Society for Testing and Materials, and ASTM International
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Summary
Results of a comprehensive ball shear testing program are presented including methods for ball shear implementation and wire bonding machine optimization. Both destructive and non-destructive ball shear are considered as complementary test methods to the more familiar wire bond pull test. Techniques for on-line production testing are presented along with suggested guidelines suitable for incorporation in a standard test method. The use of ball shear testing as a method for studying the effect of both thermal processing and contamination on the strength and morphology of the aluminum-gold interface is also considered.
Dates of Publication and/or Sequential Designation
Volume 1984, Issue 850 (January 1984)
Subject(s)
Other Subject(s)
ISBN
0803104030
9780803104037
9780803149151 (e-ISBN)
Digital File Characteristics
text file PDF
Bibliography Note
Includes bibliographical references 22.
Other Forms
Also available in PDF edition.
Also available online via the World Wide Web. Tables of contents and abstracts freely available; full-text articles available by subscription.
Full text article also available for purchase.
Reproduction Note
Electronic reproduction. W. Conshohocken, Pa. : ASTM International, 1984. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.
Technical Details
Mode of access: World Wide Web.
Source of Acquisition
ASTM International PDF Purchase price USD25.
View MARC record | catkey: 28002515