Advances in electronic packaging--2005 : presented at 2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems : July 17-22, 2005, San Francosco, California, USA / sponsored by Electronic and Photonic Packaging Division, ASME

Additional Titles:: Integration and Packaging of MEMS, NEMS, and electronic systems and InterPACK'05
Published:: New York, N.Y. : American Society of Mechanical Engineers, [2005]
Copyright Date:: ©2005
Physical Description:: 3 parts (2,401 pages) : illustrations ; 28 cm
Additional Creators:: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division and ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2005 : San Francisco, Calif.)

Availability

Browse Nearby on Shelf

Finding items...

Subject(s):

Electronic packaging—Congresses

ISBN:

0791842002

Note:

At head of title: Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.
" ... InterPACK'05 ..."--P. iii.

Bibliography Note:

Includes bibliographical references and author index.

View MARC record | catkey: 3194839