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Semiconductor Packaging : Materials Interaction and Reliability

Author
Chen, Andrea
Published
[Place of publication not identified] : Taylor & Francis, 2012.
Physical Description
1 electronic resource (216 pages)
Additional Creators
Lo, Randy
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Language Note
English
Restrictions on Access
Open Access Unrestricted online access
Summary
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Subject(s)
Other Subject(s)
ISBN
b11260
Collection
OAPEN Library.
Terms of Use and Reproduction
Creative Commons http://creativecommons.org/licenses/by-nc-nd/4.0
Creative Commons
View MARC record | catkey: 32174292