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Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies / Perry L. Martin

Author:
Martin, Perry L.
Published:
New York, N.Y. : McGraw-Hill Education, [2000]
Copyright Date:
?2000
Edition:
First edition.
Physical Description:
1 online resource (520 pages) : illustrations
Additional Creators:
Dylls, D. David, Medora, Noshirwan K., Le May, Ian, Ludwig, Lawrence L., Kaplan, Herbert, Kessler, L. W., Semmens, J. E., Roche, David J., Erickson, J. J., Devaney, John R., Van Westerhuyzen, Dennis H., Vettraino, L. G., Blanchard, Richard (Richard A.), Galler, Donald, Glover, Duncan, Kusko, Alexander, Loud, John D., Mimmack, Gregory J., Slenski, George, Denson, William, Müller, Günter, and Dunbar, William G.
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Series:
Language Note:
In English.
Contents:
Pt. 1. Introduction to electronic failure analysis -- pt. 2. Electronic failiure analysis techniques -- pt. 3. Electronic failure analysis for specific technologies. and Ch. 1. Overview of electronic component reliability -- ch. 2. Overview of electronic systems reliability -- ch. 3. Product liability -- ch. 4. Photography and optical microscopy -- ch. 5. X-ray/radiographic component inspection -- ch. 6. Infrared thermography -- ch. 7. Acoustic micro imaging failure analysis of electronic devices -- ch. 8. Metallography -- ch. 9. Chemical characterization -- ch. 10. Electronic and electrical characterization -- ch. 11. Scanning electron microscopy and x-ray analysis -- ch. 12. Miscellaneous techniques -- ch. 13. Solder joints -- ch. 14. Failure analysis of printed wiring assemblies -- ch. 15. Wires and cables -- ch. 16. Switches and relays -- ch. 17. Connection technology -- ch. 18. Failure analysis of components -- ch. 19. Semiconductors -- ch. 20. Power and high-voltage considerations.
Summary:
"In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--Jacket.
Subject(s):
Genre(s):
ISBN:
0070410445 (print-ISBN)
0071449639
9780070410442
Related Titles:
Introduction to electronic failure analysis
Overview of electronic systems reliability
Product liability
Photography and optical microscopy
X-ray/radiographic component inspection
Infrared thermography
Acoustic micro imaging failure analysis of electronic devices
Metallography
Chemical characterization
Electronic and electrical characterization
Scanning electron microscopy and x-ray analysis
Miscellaneous techniques
Solder joints
Failure analysis of printed wiring assemblies
Wires and cables
Switches and relays
Connection technology
Semiconductors
Power and high-voltage considerations
Note:
Print version c1999.
Bibliography Note:
Includes bibliographical references and index.
Other Forms:
Also available in print edition.
Reproduction Note:
Electronic reproduction. New York, N.Y. : McGraw Hill, 2000. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.
Technical Details:
Mode of access: Internet via World Wide Web.
View MARC record | catkey: 37106708