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Three-dimensional integrated circuit design / Vasilis F. Pavlidis, Eby G. Friedman

Author:
Pavlidis, Vasilis F., 1976-
Additional Titles:
3D integrated circuit design and 3 D integrated circuit design
Published:
Burlington, MA : Morgan Kaufmann, [2009]
Copyright Date:
©2009
Physical Description:
1 online resource (xiii, 309 pages) : illustrations
Additional Creators:
Friedman, Eby G.
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Series:
Contents:
Cover13; -- Three-Dimensional Integrated Circuit Design -- Copyright Page -- Dedication Page -- Contents -- Preface -- Acknowledgments -- Chapter 1: Introduction -- Chapter 2: Manufacturing of 3-D Packaged Systems -- Chapter 3: 3-D Integrated Circuit Fabrication Technologies -- Chapter 4: Interconnect Prediction Models -- Chapter 5: Physical Design Techniques for 3-D ICs -- Chapter 6: Thermal Management Techniques -- Chapter 7: Timing Optimization for Two-Terminal Interconnects -- Chapter 8: Timing Optimization for Multiterminal Interconnects -- Chapter 9: 3-D Circuit Architectures -- Chapter 10: Case Study -- Chapter 11: Conclusions -- Appendix A: Enumeration of Gate Pairs in a 3-D IC -- Appendix B: Formal Proof of Optimum Single Via Placement -- Appendix C: Proof of the Two-terminal Via Placement Heuristic -- Appendix D: Proof of Condition for Via Placement of Multiterminal Nets -- References -- Index.
Subject(s):
ISBN:
0123743435
9780123743435
1282711393
9781282711396
9780123743435 (hbk.)
Bibliography Note:
Includes bibliographical references (pages 289-303) and index.
View MARC record | catkey: 37425533