Electronic and photonics packaging : multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA / sponsored by the Electronic and Photonic Packaging Division, ASME
- Conference Author:
- International Mechanical Engineering Congress and Exposition (2006 : Chicago, Ill.)
- Additional Titles:
- Proceedings of IMECE2006, Electronic and photonics packaging 2006, and Multi-scale electrical and mechanical systems 2006
- New York : American Society of Mechanical Engineers, 
- Copyright Date:
- Physical Description:
- xix, 526 pages : illustrations ; 28 cm.
- Additional Creators:
- American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
Full Text available online
By special arrangement in response to the COVID-19 pandemic, patrons may access this resource online through the HathiTrust Emergency Temporary Access Service.
- EPP ; v. 6
- 2006 ASME MEMS/NEMS Packaging Symposium -- Symposium on Ecoelectronics -- Symposium on Novel Nano/Micro Materials and Structures for Electronic/Photonic Packaging -- Symposium on Quality and Reliability of Electronic/Photonic Packaging -- Multi-scale electrical and mechanical systems.
- 0791847691 and 9780791847695
- "Quality and reliability of electronic/photonics packaging, MEMS/NEMS packaging, MEMS/NEMS novel materials and structures, Ecoelectronics."
- Bibliography Note:
- Includes bibliographical references and index.
View MARC record | catkey: 3862044