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SOLDER LEVELING
Author
Mulholland, W. A.
Published
United States : [publisher not identified], 1971.
[Oak Ridge, Tennessee] : [U.S. Atomic Energy Commission], 1971.
Physical Description
microfiche : negative ; 11 x 15 cm
Full Text available online
Availability
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Report Numbers
BDX-613-616
Other Subject(s)
N46000* -Instrumentation
PERFORMANCE
PRINTED CIRCUITS
SOLDERING
SOLDERING/evaluation of solder leveling process for printed wiring boards
Collection
U.S. Atomic Energy Commission depository collection.
Note
DOE contract number: AT(29-1)-613
NSA number: NSA-26-027628
OSTI Identifier 4676742
Research organization: Bendix Corp., Kansas City, Mo.
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