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Actions for SOLDER LEVELING. Final Report
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SOLDER LEVELING. Final Report
Author
Mulholland, W. A.
Published
United States : [publisher not identified], 1972.
[Oak Ridge, Tennessee] : [U.S. Atomic Energy Commission], 1972.
Physical Description
microfiche : negative ; 11 x 15 cm
Full Text available online
Availability
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Report Numbers
BDX-613-739
Other Subject(s)
CIRCUITS/fabrication of printed wire-board-type, solder leveling process for
CONFIGURATION
ELECTRODEPOSITION
LEVELS
N50200* -Metals, Ceramics, & Other Materials-Metals & Alloys
PRINTED CIRCUITS
SOLDERING
SOLDERS/leveling process for printed wire board
SURFACES
Collection
U.S. Atomic Energy Commission depository collection.
Note
DOE contract number: AT(29-1)-613
NSA number: NSA-27-011560
OSTI Identifier 4612085
Research organization: Bendix Corp., Kansas City, MO (United States).
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