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Depotting electronic assemblies. Final report

Author:
Camp, C. J.
Published:
United States : [publisher not identified], 1976
[Oak Ridge, Tennessee] : [U.S. Atomic Energy Commission], 1976
Physical Description:
microfiche : negative ; 11 x 15 cm

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Summary:
The MC2807 comprises four circuit board assemblies which are encapsulated in PAPI cured polyurethane foam. A solvent formulation was sought that would remove the PAPI foam with minimum damage to the circuit board and its attached components. Several formulations were developed that met this objective.
Report Numbers:
BDX-613-1530(Rev.)
Other Subject(s):
Collection:
U.S. Atomic Energy Commission depository collection.
Note:
DOE contract number: EY-76-C-04-0613
OSTI Identifier 7316640
Research organization: Bendix Corp., Kansas City, MO (United States).
View MARC record | catkey: 39977702