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Lead-free electronic solders [electronic resource] : a special issue of Journal of Materials Science: Materials in Electronics / edited by K. N. Subramanian

Published
New York : Springer Science+Business, 2007.
Physical Description
1 volume
Additional Creators
Subramanian, K. N. and SpringerLink (Online service)
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Contents
Thermodynamics and phase diagrams of lead-free solder materials / H. Ipser, H. Flandorfer, Ch. Luef, C. Schmetterer, U. Saeed -- Phase diagrams of Pb-free solders and their related materials systems / Sinn-Wen Chen, Chao-Hong Wang, Shih-Kang Lin, Chen-Nan Chiu -- The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints / D. Swenson -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications / Iver Anderson -- Rare-earth additions to lead-free electronic solders / C. Wu, Y. Wong -- Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders / Paul Vianco, Jerome Rejent, Arlo Fossum, Michael Neilsen -- Sn-Zn low temperature solder / Katsuaki. Suganuma, Kuen-Soo. Kim -- Composite lead-free electronic solders / Fu Guo -- Processing and material issues related to lead-free soldering / Laura Turbini -- Interfacial reaction issues for lead-free electronic solders / C. Ho, S. Yang, C. Kao -- Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys / N. Chawla, R. Sidhu -- Deformation behavior of tin and some tin alloys / Fuqian Yang, J. Li -- Mechanical fatigue of Sn-rich Pb-free solder alloys / J. Shang, Q. Zeng, L. Zhang, Q. Zhu -- Life expectancies of Pb-free SAC solder interconnects in electronic hardware / Michael Osterman, Abhijit Dasgupta -- Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments / K. Subramanian -- Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages / Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Huang-Lin Chao, Paul Ho, Min Ding, Peng Su, Trent Uehling, Lakshmi Ramanathan -- Electromigration issues in lead-free solder joints / Chih Chen, S. Liang -- Stress analysis of spontaneous Sn whisker growth / K. Tu, Chih Chen, Albert Wu -- Sn-whiskers: truths and myths / J. Osenbach, J. DeLucca, B. Potteiger, A. Amin, F. Baiocchi -- Tin pest issues in lead-free electronic solders / W. Plumbridge -- Issues related to the implementation of Pb-free electronic solders in consumer electronics / D. Frear -- Impact of the ROHS directive on high-performance electronic systems / Karl Puttlitz, George Galyon -- Impact of the ROHS Directive on high-performance electronic systems / Karl Puttlitz, George Galyon
Subject(s)
ISBN
9780387484334
Related Titles
Journal of Materials Science. Materials in Electronics
Note
Description based on print version record.
"This book contains the papers that were invited for a special issue of Journal of Materials Science: Materials in Electronics...to provide wider awareness of the current status of lead-free electronic solders..."--Preface.
AVAILABLE ONLINE TO AUTHORIZED PSU USERS.
Bibliography Note
Includes bibliographical references and index.
Reproduction Note
Electronic reproduction. Berlin : Springer, 2007. Mode of access: World Wide Web. Available via SpringerLink.
View MARC record | catkey: 4206744