Proceedings of the Munich Symposium on Lightweight Design 2022 [electronic resource] : Tagungsband zum Münchner Leichtbauseminar 2022 / herausgegeben von Jasper Rieser, Felix Endress, Alexander Horoschenkoff, Philipp Höfer, Tobias Dickhut, Markus Zimmermann
Published
Cham : Springer International Publishing : Imprint: Springer Vieweg, 2023.
Edition
1st ed. 2023.
Physical Description
X, 146 p. 102 illus., 85 illus. in color. online resource
Every year, the Technical University of Munich, the Universität der Bundeswehr München, and the University of Applied Sciences in Munich invite researchers and practitioners to join the Munich Symposium on Lightweight Design. Experts from industry and academia discuss design tools, applications, and new developments. Topics include, e.g., composite structures, SHM, microstructures, material modelling, design for additive manufacturing, numerical optimization and in particular topology optimization in aerospace, automotive and other industries. The talks are summarized in short articles and presented in this volume.