Fracture surface micromorphology of Inconel X-750 at room temperature and elevated temperatures

Author: Mills, W. J.
Published: United States : [publisher not identified], 1977.
[Oak Ridge, Tennessee] : [U.S. Atomic Energy Commission], 1977.
Physical Description: microfiche : negative ; 11 x 15 cm

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Summary

The fracture surface micromorphology of Inconel X-750 has been examined in order to relate operative fracture mechanisms to key microstructural features. Under room temperature and intermediate temperature (approximately 600/sup 0/F) conditions, failure occurred primarily by an intergranular dimple rupture mechanism associated with microvoid coalescence along a grain boundary denuded region. At progressively higher temperatures an intergranular to transgranular fracture mechanism transition was detected. In the 1000 to 1300/sup 0/F regime, the Inconel X-750 fracture surfaces were dominated by a faceted transgranular morphology. This faceted appearance was attributed to extensive heterogeneous planar slip, characteristic of many nickel-base superalloys.

Report Numbers

HEDL-TME-77-64

Other Subject(s)

Collection

U.S. Atomic Energy Commission depository collection.

Note

DOE contract number: EY-76-C-14-2170
OSTI Identifier 5348630
Research organization: Hanford Engineering Development Lab., Richland, WA (United States).

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