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Introduction to microsystem packaging technology / Yufeng Jin, Zhiping Wang, Jing Chen

Author
Jin, Yufeng
Published
Boca Raton : Taylor & Francis, 2011.
Physical Description
1 online resource (xiii, 218 pages)
Additional Creators
Wang, Zhiping, 1962 October 6- and Chen, Jing, 1974-
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Contents
ch. 1. Introduction -- ch. 2. Design technique for microsystems packaging and integration -- ch. 3. Substrate technology -- ch. 4. Interconnection technology -- ch. 5. Device-level packaging -- ch. 6. MEMS packaging -- ch. 7. Module assembly and optoelectronic packaging -- ch. 8. System-level packaging technology -- ch. 9. Reliability -- ch. 10. Prospects for microsystems packaging technology.
Subject(s)
ISBN
9781315217086 (e-book : PDF)
9781351824286 (e-book: Mobi)
9781439865972 (e-book: PDF)
9781439819104 (hardback)
Note
A CRC title.
View MARC record | catkey: 46445436