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Actions for Correlation between bond reliability and solid phase bonding techniques for contaminated bonding surfaces
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Correlation between bond reliability and solid phase bonding techniques for contaminated bonding surfaces
Author
Bushmire, D. W.
Published
United States : [publisher not identified], 1975.
[Oak Ridge, Tennessee] : [U.S. Atomic Energy Commission], 1975.
Physical Description
microfiche : negative ; 11 x 15 cm
Additional Creators
Holloway, P. H.
Full Text available online
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Report Numbers
SAND-75-0281
Other Subject(s)
42 engineering
420800 - engineering- electronic circuits & devices- (-1989).
Aluminium
Bonding
Electronic circuits
Elements
Fabrication
Gold
Joining
Metals
Microelectronic circuits
Reliability
Substrates
Transition elements
Wires
Collection
U.S. Atomic Energy Commission depository collection.
Note
DOE contract number: AT(29-1)-789
OSTI Identifier 5092246
Research organization: Sandia Labs., Albuquerque, N.Mex. (USA).
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