Hybrid microcircuit metallization system for the SLL micro actuator

Author: Hampy, R. E.
Published: United States : [publisher not identified], 1976.
[Oak Ridge, Tennessee] : [U.S. Atomic Energy Commission], 1976.
Physical Description: microfiche : negative ; 11 x 15 cm
Additional Creators: Knauss, G. L., Komarek, E. E., Kramer, D. K., and Villaueva, J.

Availability

Finding items...

Summary

A thin film technique developed for the SLL Micro Actuator in which both gold and aluminum can be incorporated on sapphire or fine grained alumina substrates in a two-level metallization system is described. Tungsten is used as a lateral transition metal permitting electrical contact between the gold and aluminum without the two metals coming in physical contact. Silicon dioxide serves as an insulator between the tungsten and aluminum for crossover purposes, and vias through the silicon dioxide permit interconnections where desired. Tungsten-gold is the first level conductor except at crossovers where tungsten only is used and aluminum is the second level conductor. Sheet resistances of the two levels can be as low as 0.01 ohm/square. Line widths and spaces as small as 0.025 mm can be attained. A second layer of silicon dioxide is deposited over the metallization and opened for all gold and aluminum bonding areas. The metallization system permits effective interconnection of a mixture of devices having both gold and aluminum terminations without creating undesirable gold-aluminum interfaces. Processing temperatures up to 4000/C can be tolerated for short times without effect on bondability, conductor, and insulator characteristics, thus permitting silicon-gold eutectic die attachment, component soldering, and higher temperatures during gold lead bonding. Tests conducted on special test pattern circuits indicate good stability over the temperature range -55 to +1500/C. Aging studies indicate no degradation in characteristics in tests of 500 h duration at 1500/C.

Report Numbers

SAND-75-0313

Other Subject(s)

Collection

U.S. Atomic Energy Commission depository collection.

Note

DOE contract number: AT(29-1)-789
OSTI Identifier 7351044
Research organization: Sandia Labs., Albuquerque, NM (United States).

Funding Information

Sponsored by US Energy Research and Development Administration (ERDA).

View MARC record | catkey: 47032515