Actions for Thin film adhesion and adhesive failure : a perspective

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Thin film adhesion and adhesive failure : a perspective

Author
Mattox, D. M.
Published
United States : [publisher not identified], 1976.
[Oak Ridge, Tennessee] : [U.S. Atomic Energy Commission], 1976.
Physical Description
microfiche : negative ; 11 x 15 cm

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Summary
A practical definition of ''good adhesion'' is that the interfacial region (or nearby material) does not fail under service conditions nor at unacceptably low stress levels under test conditions. Adhesion is a macroscopic property that depends on the chemical and mechanical bonding across the interfacial region, the intrinsic stress and stress gradients, and the adhesive failure mode. The failure mode depends on the interfacial structure and the stress to which the interface is subjected. Good adhesion is promoted by: (1) strong bonding across the interfacial region, (2) low stress gradients, either from intrinsic or applied stress, (3) absence of easy fracture modes, and (4) no long-term degradation modes. Adhesion testing must take into account the possible deformation and fracture modes and a testing program must be devised to test all aspects of adhesion. 57 references.
Report Numbers
SAND-76-5946; CONF-761119-1
Other Subject(s)
Collection
U.S. Atomic Energy Commission depository collection.
Note
DOE contract number: E(29-1)-789
OSTI Identifier 7334661
Research organization: Sandia Labs., Albuquerque, NM (USA).
View MARC record | catkey: 47075843