Actions for Study of process variables for flat cable covercoat lamination
Study of process variables for flat cable covercoat lamination
- Author
- Stein, J. D.
- Published
- United States : [publisher not identified], 1985
Springfield, Va.: National Technical Information Service, [approximately 1985] - Physical Description
- microfiche : negative ; 11 x 15 cm
- Additional Creators
- Fossey, D. J.
- Summary
- Press lamination of Kapton covercoat for flat flex cables requires the specification of limits for many variables. Correlation of these variables to product performance can be difficult. Traditional peel strength tests and product functional tests are helpful; however, many samples are required to establish confidence that a process change is significant. An experiment was conducted to determine the effect of eight process variables: material supplier, adhesive thickness, size, humidity, lamination pressure, lay-up method, press cycle, and circuit pattern. Samples were subjected to elevated temperature within a vacuum and the temperature at which delamination occurred was used as the experimental response. The presence of a circuit pattern was found to be the only significant variable for covercoat lamination. The base laminate consisting of copper/Kapton/copper was found to vary with supplier and one roll-laminated material was improved with press lamination pressure and lay-up method. The screening experiment provides a basis for continued evaluation of suppliers for the Kapton-acrylic adhesive system. The significant circuit pattern effect provides a basis for investigation of circuit panel designs that facilitate air removal. Panel designs that include borders of copper can be tested with bleeded channels within the borders included as part of the design.
- Report Numbers
- DE85014698; BDX-613-3281
- Other Subject(s)
- Collection
- NTIS collection.
- Note
- DOE contract number: AC04-76DP00613
OSTI Identifier 5650222
Research organization: Allied Corp., Kansas City, MO (USA). Bendix Kansas City Div.
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