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Solder Joint Reliability Prediction for Multiple Environments [electronic resource] / by Andrew E. Perkins, Suresh K. Sitaraman

Author: Perkins, Andrew E.
Published: Boston, MA : Springer Science+Business Media, LLC, 2009.
Physical Description: volumes: digital
Additional Creators: Sitaraman, Suresh K. and SpringerLink (Online service)

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ISBN

9780387793948

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AVAILABLE ONLINE TO AUTHORIZED PSU USERS.

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Springer eBooks

View MARC record | catkey: 7287708